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ITMS4037 XC2S50E 01049 TA7687AF 74VCX16 FRE260R UMD3N1 4ALVC
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  multilayer ceramic chip capacitors 1 of 3 creation date : april 24, 2017 (gmt) c1608jb1e224m080aa tdk item description c1608jb1e224mt**** applications commercial grade feature general general (up to 50v) series c1608 [eia 0603] status production (not recommended for new design) size length(l) 1.60mm 0.10mm width(w) 0.80mm 0.10mm thickness(t) 0.80mm 0.10mm terminal width(b) 0.20mm min. terminal spacing(g) 0.30mm min. recommended land pattern (pa) 0.70mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pb) 0.80mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pc) 0.60mm to 0.80mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) electrical characteristics capacitance 220nf 20% rated voltage 25vdc temperature characteristic jb(10%) dissipation factor (max.) 3% insulation resistance (min.) 2272m other soldering method wave (flow) re?ow aec-q200 no packing punched (paper)taping [180mm reel] package quantity 4000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : april 24, 2017 (gmt) c1608jb1e224m080aa characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance c1608jb1e224m080aa esr c1608jb1e224m080aa capacitance c1608jb1e224m080aa dc bias characteristic c1608jb1e224m080aa temperature characteristic c1608jb1e224m080aa(no bias) c1608jb1e224m080aa(dc bias = 12.5v ) ripple temperature rising c1608jb1e224m080aa(100khz) c1608jb1e224m080aa(500khz) c1608jb1e224m080aa(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : april 24, 2017 (gmt) c1608jb1e224m080aa associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.


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